NTD20N06L-001【PDF 1/8 页】MOSFET N-CH 60V 20A IPAK

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NTD20N06L, NTDV20N06L

Power MOSFET

20 Amps, 60 Volts

Logic Level, N ? Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

http://onsemi.com

circuits.

Features

? AEC Q101 Qualified ? NTDV20N06L

? These Devices are Pb ? Free and are RoHS Compliant

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

V (BR)DSS

60 V

R DS(on) TYP

39 m W@ 5.0 V

N ? Channel

I D MAX

20 A

(Note 1)

Rating

Symbol

Value

Unit

Drain ? to ? Source Voltage

Drain ? to ? Gate Voltage (R GS = 10 M W )

V DSS

V DGR

Vdc

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Gate ? to ? Source Voltage

? Continuous

? Non ? repetitive (t p v 10 ms)

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

V GS

I D

I DM

P D

" 15

" 20

0.40

1.88

1.36

Vdc

Adc

Apk

W/ ° C

1 2

DPAK

CASE 369C

(Surface Mount)

STYLE 2

Gate

Drain

Source

Operating and Storage Temperature Range

T J , T stg

? 55 to

+175

° C

Drain

Single Pulse Drain ? to ? Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 25 Vdc, V GS = 5.0 Vdc,

L = 1.0 mH, I L (pk) = 16 A, V DS = 60 Vdc)

Thermal Resistance

? Junction ? to ? Case

? Junction ? to ? Ambient (Note 1)

? Junction ? to ? Ambient (Note 2)

E AS

R q JC

R q JA

128

2.5

110

° C/W

DPAK

CASE 369D

(Straight Lead)

STYLE 2

1 2 3

Gate Drain Source

Maximum Lead Temperature for Soldering T L 260 ° C

Purposes, 1/8 in from case for 10 seconds

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 1 in pad size, (Cu Area 1.127 in 2 ).

2. When surface mounted to an FR4 board using recommended pad size,

(Cu Area 0.412 in 2 ).

Y = Year

WW = Work Week

20N6L = Device Code

G = Pb ? Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

? Semiconductor Components Industries, LLC, 2011

October, 2011 ? Rev. 3

Publication Order Number:

NTD20N06L/D

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